AMD Public PowerPoint

Driving Leading Edge Microprocessor Technology Dr. Hans Deppe Corporate Vice President & General Manager AMD in Dresden

October 3, 2005

AMD Overview A leading global supplier of innovative semiconductor solutions for the personal and enterprise computing, communications and consumer electronic markets • Founded: 1969

• Products:

• Headquarters: Sunnyvale, California • Employees: ~16,700 worldwide • Sales 2004: $ 5.0 billion

- Microprocessors & Personal Connectivity Solutions - Flash Memory Products

• Revenue increase 2003/2004: 42 % • Sales Mix: 78% international

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October 3, 2005

Saxon-British Nanotechnology Forum

AMD worldwide Boston, Massachusetts Sunnyvale, California

Boston Design Center

~ $ 5 billion investment 1996 - 2007

AMD global HQ Spansion global HQ Submicron Development Center

Aizu-Wakamatsu/ Tokyo, Japan Flash Memory Fabs Spansion Japan HQ Japan Engineering Lab

Bangkok, Thailand Dresden, Germany

Longmont, CO

Flash Memory Assembly and Test

Suzhou, China Microprocessor and Flash Memory Assembly and Test

Fab 30 — Fab 36 — Microprocessors Dresden Design Center

Design Center

Austin, Texas Fab 25 — Flash Memory Computation Product Group Personal Connectivity Solutions Group

Singapore Microprocessor Test, Mark and Pack

Banglore, India Engineering Center

Penang/ Kuala Lumpur, Malaysia Microprocessor and Flash Assembly Test and Packaging

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October 3, 2005


AMD Fab 30 – “Leading Edge” for Microprocessor Technology AMD Fab 30 runs full product range in high volume production Leadership: First to volume copper First to volume SOI First to volume low-k

AMD Opteron™ processor and AMD Athlon™ 64 processor running mature yields 90 nm in volume production

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October 3, 2005


AMD Fab 36 — AMD’s next flagship Based on the superior manufacturing performance of AMD in Dresden

November 2003: Groundbreaking November 2004: Ready for Equipment

Planned for 65nm, 45nm and 32nm technology generations

March 2005: First wafer started

Technology alliance between AMD & IBM

October 2005: Grand Opening

Planned investment until 2007: $2.5 Billion

2006: Volume shipments to market

AMD Fab 36 AMD Fab 30

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October 3, 2005


Highly Successful 90nm Technology Transition High yield at start of volume production Builds on 130nm SOI success Increased thermal efficiencies

90nm

130nm

193mm2

115mm2

Significant die-size reductions Addition of strained silicon transistor technology

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October 3, 2005

90nm

130nm

145mm2


84mm2

SOI: Dramatically Improved Performance and Power Efficiencies

At equivalent Off current, SOI can provides up to 18% performance improvement over bulk-Si technology

12 Delay/Stage (ps)

Silicon-on-Insulator Advantages:

VDD=1.4V T=25oC

11 10 9

PD/SOI Bulk-Si

8 1

10

100

1000

ID-off (n+2p) (nA/μm)

Vertical Cj component is eliminated thus RC delay can be decreased Higher Reliability due to elimination of latch-up effect and higher radiation hardness

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October 3, 2005

SOI

Bulk

G

G S

D

S

P-substrate


D SiO2 BOX

Eliminating Architectural Bottlenecks CPU CPU

8 GB/S

CPU CPU

8 GB/S

I/O I/OHub Hub

PCI-E PCI-E Bridge Bridge PCI-E PCI-E Bridge Bridge PCI-E PCI-E Bridge Bridge

Memory Memory PCI-E PCI-E Controller Controller Bridge Bridge Hub Hub

8 GB/S

PCI-E PCI-E Bridge Bridge

PCI-E PCI-E Bridge Bridge

8 GB/S

I/O I/OHub Hub

Legacy x86 Architecture • • • •

20-year old front-side bus architecture CPUs, Memory, I/O all share a bus Major bottleneck to performance Faster CPUs or more cores ≠ performance

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October 3, 2005

USB USB PCI PCI

AMD64 Technology with Direct Connect Architecture • Industry-standard AMD64 technology • AMD’s revolutionary Direct Connect Architecture eliminates FSB bottleneck • HyperTransport™ Technology interconnect for high bandwidth and low latency


Transistor Roadmap Source: AMD and ITRS-Roadmap from the SIA

SOI and Copper Technology

Lg = 32 nm

Lg = 13 nm

Transistor For 90 nm

Lg = 22 nm 22nm-Generation

(2011) 32nm-Generation 45nm-Generation

(2009) 3.01 B Transistors per Chip

(2007) 65nm-Generation

1.5 B Transistors per Chip

(2005) 90nm-Generation

380 M Transistors per Chip

(2003)

180 M Transistors per Chip

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October 3, 2005


APM: Unique Technology Framework Over 400 AMD patented or patent-pending technologies

Highly automated and synchronized decision making

Equipment Performance Optimization

Yield Management Systems

Product Performance Targeting

APM Framework

Integrated Production Scheduling

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Advanced Process Control

October 3, 2005

Five integrated algorithmic analysis systems — much more than just APC Includes proprietary technologies, logic and business processes Fed by fab-wide tool and data integration


APM is More than Great Technology Seamless blending of the best people and the best technologies is what makes APM so successful

Unique Technology Framework

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October 3, 2005

APM

Unique Employee Skill Sets


Ongoing Success in Saxony Dresden: One of Europe’s largest microelectronics clusters Center of operations for AMD microprocessor fabrication Tremendous ongoing success for AMD, The Free State of Saxony, and Germany Over 7,000 jobs directly or indirectly created by AMD since 1996

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October 3, 2005


Delivering on the Promise: Balance of AMD‘s engagement in Dresden Plan 1995 Direct jobs

Plan 2007

1.430

~3.000

Indirect jobs*

~2.100

~4.500

Jobs created

~3.500

~7.500

1,9

~5,0

Investment in $ billions

* Creation of ~ 1.5 indirect jobs per each direct AMD job Source: DIW, AMD

We have made commitments – we have met our commitments.

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October 3, 2005


AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this presentation are for identification purposes only and may be trademarks of their respective companies. ©Copyright 2005 Advanced Micro Devices, Inc. All rights reserved.

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October 3, 2005
