Guest Editorial. Special Issue on Interface Reliability. THIS special issue of the IEEE TRANSACTIONS ON DEVICE. AND MATERIALS RELIABILITY (T-DMR) is ...
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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 3, NO. 4, DECEMBER 2003
Guest Editorial Special Issue on Interface Reliability
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HIS special issue of the IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (T-DMR) is designed to address the increasing tendency for critical interfaces to crack, delaminate, and cause reliability failure, particularly as the industry migrates to copper/low- with its poor mechanical properties and poor adhesion. However, the issues discussed are applicable well beyond copper/low- , pertaining to any composite structure fabricated from dissimilar materials where the mechanical loading effects will most frequently result in interface fracture. The issue begins with two papers, by Mercado et al. and by Wang et al., that have similar approaches for finite-element multilevel submodeling methodology. Similar conclusions regarding the deleterious effect of organic substrates on copper/low- are reached. Another modeling paper, by Nied, presents an in-depth mathematical treatment of interface fracture. Next, two more modeling papers, by Tay and Goh and by Meyyappan et al., address die-attach delamination during assembly and solder reflow. Hoontrakul et al. discuss effects of polyimide chemistry on epoxy/polyimide adhesion. Changing focus, two papers, by van Spengen et al. and by Ashurst et al., address prediction of stiction failures in MEMs and chemical approaches to reducing stiction. Finally, a paper by Dias dealing with the nondestructive analytical approaches to investigate interface integrity is presented.
For more information concerning T-DMR and its Editor-in-Chief and Editors, please visit the T-DMR website at www.ieee.org/tdmr/. Past issues of T-DMR are available at http://www.ieee.org/xploretdmr.
Digital Object Identifier 10.1109/TDMR.2003.822338 1530-4388/03$17.00 © 2003 IEEE
RICHARD BLISH, Guest Editor Advanced Microdevices Technology Development Group Sunnyvale, CA 94088 USA ARIS CHRISTOU, Guest Editor University of Maryland Department of Materials Science and Engineering College Park, MD 20742 USA ROBERT THOMAS, Guest Editor Technology Experts Network Rome, NY 13440 USA GAY SAMUELSON, Guest Editor Intel Corporation Chandler, AZ 85248 USA
