handbook of heat transfer

117 downloads 7027 Views 88KB Size Report
Massachusetts Institute of Technology. James R Hartnett ... Dong, Z.F. Department of Mechanical Engineering, Florida International University (CHAP. 5, Forced.
HANDBOOK OF HEAT TRANSFER Warren M. Rohsenow

Editor

Department of Mechanical Engineering Massachusetts Institute of Technology

James R Hartnett

Editor Energy Resources Center University of Illinois at Chicago

Young I. Cho Editor Department of Mechanical Engineering and Mechanics Drexel University

Third Edition

MCGRAW-HILL New York San Fran©isco Washington, D.C. Auckland Bogot6 Caracas Lisbon London Madrid Mexi©oCity Milan Montreal New Delhi San Juan Singapore Sydney Tokyo Toronto

Library of Congress Cataloging-in-Publication Data H a n d b o o k of heat transfer / editors, W.M. Rohsenow, J.P. H a r t n e t t , Y.I. Cho. m 3rd ed. p. cm. Includes bibliographical references and index. I S B N 0-07-053555-8 (alk. p a p e r ) 1. H e a t - - T r a n s m i s s i o n m H a n d b o o k s , manuals, etc. 2. Mass t r a n s f e r m H a n d b o o k s , manuals, etc. I. Rohsenow, W. M. ( W a r r e n M.) II. H a r t n e t t , J. E (James E) III. Cho, Y. I. (Young I.) QC320.4.H36 1998 621.402'2--dc21 97-51381 CIP

McGraw-Hill A Division o[ The McGraw.Hill ~ i e s

Copyright © 1998 by The McGraw-Hill Companies, Inc. All rights reserved. Printed in the United States of America. Except as permitted under the United States Copyright Act of 1976, no part of this publication may be reproduced or distributed in any form or by any means, or stored in a data base or retrieval system, without the prior written permission of the publisher. 1 2 3 4 5 6 7 8 9 0

DOC/DOC

9 0 3 2 1 0 9 8

ISBN 0-07-053555-8

The sponsoring editor for this book was Robert Esposito, the editing supervisor was Stephanie S. Landis, and the production supervisor was Pamela A. Pelton. It was set in Times Roman by North Market Street Graphics. Printed and bound by R. R. Donnelley & Sons Company. McGraw-Hill books are available at special quantity discounts to use as premiums and sales promotions, or for use in corporate training programs. For more information, please write to the Director of Special Sales, McGraw-Hill, 11 West 19th Street, New York, NY 10011. Or contact your local bookstore.

Information contained in this work has been obtained by The McGraw-Hill Companies, Inc. ("McGraw-Hill") from sources believed to be reliable. However, neither McGraw-Hill nor its authors guarantee the accuracy or completeness of any information published herein, and neither McGraw-Hill nor its authors shall be responsible for any errors, omissions, or damages arising out of use of this information. This work is published with the understanding that McGraw-Hill and its authors are supplying information but are not attempting to render engineering or other professional services. If such services are required, the assistance of an appropriate professional should be sought.

This book is printed on acid-flee paper.

CONTRIBUTORS

Bergles, Arthur E. Department of Mechanical Engineering, Rensselaer Polytechnical Institute (CHAP. 11, Techniques to Augment Heat Transfer), e-mail: [email protected] Bergman, Theodore L. Departmentof Mechanical Engineering, University of Connecticut (CHAP. 18, Heat Transfer in Materials Processing), e-mail: [email protected] Chauk, Shriniwas Departmentof Chemical Engineering, Ohio State University (CHAP. 13, Heat Transfer in Fluidized and Packed Beds) Chen, Ping-Hai Department of Mechanical Engineering, National Taiwan University, Taiwan, ROC (CHAP. 16, Measurement of Temperature and Heat Transfer), e-mail: [email protected] Chiang, Hwai Derg IndustrialTechnology Research Institute, Taiwan, ROC (CHAP.16, Measurement of Temperature and Heat Transfer), e-mail: [email protected] Cho, Young I. Departmentof Mechanical Engineering and Mechanics, Drexel University (CHAP.1, Basic Concepts of Heat Transfer; CHAP.10, Nonnewtonian Fluids), e-mail: [email protected]

Dong, Z.F. Departmentof Mechanical Engineering, Florida International University (CHAP. 5, Forced Convection, Internal Flows), e-mail: [email protected] Ebadian, M.A. Hemispheric Center for Environmental Technology, Florida International University (CHAP. 5, Forced Convection, Internal Flows), e-mail: [email protected] Fan, L.S. Departmentof Chemical Engineering, Ohio State University (CHAP.13, Heat Transfer in Fluidized and Packed Beds), e-mail: [email protected] Goldstein, Richard J. Department of Mechanical Engineering, University of Minnesota (cHar,. 16, Measurement of Temperature and Heat Transfer), e-mail: [email protected] Hartnett, J a m e s P. Energy Resources Center, University of Illinois, Chicago (CHAP. 1, Basic Concepts of Heat Transfer; CHAP.10, Nonnewtonian Fluids), e-mail: [email protected]

Hewitt, Geoffrey F. Departmentof Chemical Engineering and Chemical Technology, Imperial College of Science, Technology and Medicine, London, UK (CHAP. 15, Boiling), e-mail: [email protected] Hollands, K. G.T. Department of Mechanical Engineering, University of Waterloo, Canada (CHAP. 4, Natural Convection), e-mail: [email protected] Howell, John R. Departmentof Mechanical Engineering, University of Texas at Austin (CHAP.7, Radiation), e-mail: [email protected] Inouye, Mamoru Flows)

Ames Research Center--NASA (retired) (CHAP.6, Forced Convection, External

Irvine, Thomas F., Jr. Departmentof Mechanical Engineering, State University of New York (CHAP.2, Thermophysical Properties), e-mail: [email protected] Kaviany, Massoud Department of Mechanics and Applied Mechanics Engineering, University of Michigan (CHAP.9, Heat Transfer in Porous Media), e-mail: [email protected] Majumdar, Arun Departmentof Mechanical Engineering, University of California, Berkeley (CHAP.8, Microscale Heat Transfer), e-mail: [email protected] i a r t o , Paul J. Departmentof Mechanical Engineering, Naval Postgraduate School (CHAP.14, Condensation), e-mail: [email protected]

XVII

xviii

CONTRIBUTORS MengO;, M. Pinar Department of Mechanical Engineering, University of Kentucky (CHAP. 7, Radiation), e-mail: [email protected] Peterson, G. P. Bud Departmentof Mechanical Engineering, Texas A&M University (CHAP. 12, Heat Pipes), e-mail: [email protected] Parikh, Pradip G. Boeing Commercial Airplane Group (CHAP.6, Forced Convection, External Flows), e-mail: [email protected]

Raithby, George D. Departmentof Mechanical Engineering, University of Waterloo, Canada (CHAP.4, Natural Convection), e-mail: [email protected] Rubesin, Morris W. Ames Research Center--NASA (retired) (CHAP. 6, Forced Convection, External Flows), e-mail: [email protected] Sekulic, Dusan P. Department of Mechanical Engineering, University of Kentucky (CHAP. 17, Heat Exchangers), e-mail: [email protected]

Shah, Ramesh K. Delphi Harrison Thermal Systems, Lockport, NY (CHAP. 17, Heat Exchangers), e-mail: [email protected] Viskanta, Raymond Schoolof Mechanical Engineering, Purdue University (CHAP.18, Heat Transfer in Materials Processing), e-mail: [email protected] Yovanovich, M. Michael Departmentof Mechanical and Electrical Engineering, University of Waterloo, Canada (CHAP.3, Conduction), e-mail: [email protected]

PREFACE

INTRODUCTION Since the publication of the second edition of Handbook of Heat Transfer, there have been many new and exciting developments in the field, covering both fundamentals and applications. As the role of technology has grown, so too has the importance of heat transfer engineering. For example, in the industrial sector heat transfer concerns are critical to the design of practically every process. The same is true of such vitally important areas as energy production, conversion, and the expanding field of environmental controls. In the generation of electrical power, whether by nuclear fission or combustion of fossil fuels, innumerable problems remain to be solved. Similarly, further miniaturization of advanced computers is limited by the capability of removing the heat generated in the microprocessors. Heat transfer problems at the macro scale, as exemplified by global warming, also offer tremendous challenges. As technology advances, engineers are constantly confronted by the need to maximize or minimize heat transfer rates while at the same time maintaining system integrity. The upper and lower boundariesmsystem size, pressure, and temperature--are constantly expanding, confronting the heat transfer engineer with new design challenges. In preparing this third edition, the goal of the editors was to provide, in a single volume, up-to-date information needed by practicing engineers to deal with heat transfer problems encountered in their daily work. This new edition of the handbook contains information essential for design engineers, consultants, research engineers, university professors, students, and technicians involved with heat transfer technology.

COVERAGE The third edition of Handbook of Heat Transfer provides expanded treatment of the fundamental topics covered in earlier editions. More than half of the authors of these basic chapters on conduction, convection, radiation, condensation, and boiling are new, reflecting the fact that there are new leaders in the field. Those chapters in the second edition dealing with applications related to the so-called energy crisis (solar energy, energy storage, cooling towers, etc.) have been replaced by new chapters treating heat transfer problems encountered in materials processing, porous media, and micro scale systems. Sections on the following topics were retained and updated: thermophysical properties, heat transfer enhancement, heat exchangers, heat pipes, fluidized beds, nonnewtonian fluids, and measurement techniques.

UNITS It is recognized at this time that the English Engineering System of units cannot be completely replaced by the International System (SI). Transition from the English system of units to SI will proceed at a rational pace to accommodate the needs of the profession, industry, and the public. The transition period will be long and complex, and duality of units probably will xix

~t

PREFACE be demanded for at least one or two decades. Both SI and English units have been incorporated in this edition to the maximum extent possible, with the goal of making the handbook useful throughout the world. In general, numerical results, tables, figures, and equations in the handbook are given in both systems of units wherever presentation in dimensionless form is not given. In a few cases, some tables are presented in one system of units, mostly to save space, and conversion factors are printed at the end of such tables for the reader's convenience.

NOMENCLATURE An attempt has been made by the editors to use a unified nomenclature throughout the handbook. Given the breadth of the technical coverage, some exceptions will be found. However, with few exceptions, one symbol has only one meaning within any given section. Each symbol is defined at the end of each section of the handbook. Both SI and English units are given for each symbol in the nomenclature lists.

INDEX This edition provides a comprehensive alphabetical index designed to provide quick reference to information. Taken together with the Table of Contents, this index provides quick and easy access to any topic in the book.

ACKNOWLEDGMENTS The editors acknowledge the outstanding performance of the contributing authors. Their cooperation on the contents and length of their manuscripts and in incorporating all of the previously mentioned specifications, coupled with the high quality of their work, has resulted in a handbook that we believe will fulfill the needs of the engineering community for many years to come. We also wish to thank the professional staff at McGraw-Hill Book Company, who were involved with the production of the handbook at various stages of the project, for their cooperation and continued support. The outstanding editorial work of Ms. Stephanie Landis of North Market Street Graphics is gratefully acknowledged. The handbook is ultimately the responsibility of the editors. Care has been exercised to minimize errors, but it is impossible in a work of this magnitude to achieve an error-free publication. Accordingly, the editors would appreciate being informed of any errors so that these may be eliminated from subsequent printings. The editors would also appreciate suggestions from readers on possible improvements in the usefulness of the handbook so that these may be included in future editions. W. M. Rohsenow J. E Hartnett Y. I. Cho