exclusively on RFIC technology and innovation. ... advantages for a multi-market business embedded ... wireless SoC that performs flawlessly at the pack-.
CONFERENCES
IEEE Radio Frequency Integrated Circuits Symposium (RFIC) to Open Microwave Week 2008 in Atlanta Jenshan Lin, Tina Quach & Yann Deval RFIC General Chair RFIC Technical Program Chairs
The IEEE Radio Frequency Integrated Circuits (RFIC) Symposium will return to Atlanta, Georgia on June 1517, 2008 to open Microwave Week 2008 -- the largest world-wide RF/Microwave meeting of the year. Held in conjunction with the IEEE MTT-S International Microwave Symposium and the International Microwave Symposium and Exhibit, RFIC adds to the excitement of Microwave Week with three days focused exclusively on RFIC technology and innovation. As activity in RFIC technologies has grown, the number of papers submitted to the Symposium has reached an all-time high. Our Technical Program Committee carefully reviewed and selected excellent papers for 27 oral sessions, an Interactive Forum, and two panel sessions covering nearly all facets of RFIC technology on Monday and Tuesday, June 16th and 17th. The symposium will also offer 12 workshops and tutorials on Sunday, June 15th. On Sunday evening, a Plenary Session will be held with keynote addresses given by two renowned industry leaders: The first speaker, Robert Van Buskirk (President, Multi-market Products Group, RFMD, Inc.), will present a talk entitled “Best of Both Worlds: Multi-market Diversity Embedded in a Scale RF Semiconductor Business.” Abstract: Many RF semiconductor companies seek a balance between scale-driven, high volume business demands and more diverse, lower volume business requirements. Successful RF companies can manage these potentially conflicting business goals and realize significant advantages through the balance of scale and multi-market diversity. Using the acquisition of Sirenza Microdevices by RFMD in November 2007 as a platform to discuss this balance, the significant competitive advantages for a multi-market business embedded in a scale RF business will be addressed. This talk will explore the benefits of these unique competitive advantages and give concrete examples of how growth can be accelerated by leveraging the “Best of Both Worlds.” The second speaker, Dr. Zoltan J. Cendes (Founder, Chairman and CTO, Ansoft Corporation), will give a
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IEEE SSCS NEWS
talk entitled “First Pass System Success - When First Pass Silicon Success is Not Enough.“ Abstract: Advances in the performance and accuracy of design automation software and electromagnetic modeling have enabled RFIC designers to apply their skills to achieve first pass silicon success for complex mixed-signal radio circuits. Now, coupling between circuit simulation and parameterized electromagnetics allows them to include detailed analysis of packaging and printed circuit board parasitic coupling to track system performance. A silicon vendor may produce a wireless SoC that performs flawlessly at the packaged part level. Once that part is placed on a system PCB, the complex interactions among traces on the board, the coupled impedances between package pins and the PCB, and nonlinear effects in the circuit itself can combine to generate spurious radiation and corrupt signal/power integrity. These undesired effects can be predicted by applying full electromagnetic simulation of the package and board in concert with a top-level transient or harmonic balance simulation at the circuit level. We present an overview of key simulation technologies and discuss how they can be applied to achieve first pass system success for complex electronic products. The three best student paper awards will be presented in the Plenary Session. Immediately after the Plenary Session, the highly anticipated RFIC Reception will provide a relaxing time for all to mingle with old friends and catch up on the latest news. With an exciting technical program focusing on technical accomplishments in RF systems, circuit, device and packaging technologies for mobile phones, wireless communication systems, broadband access modems, radar systems and intelligent transport systems, the RFIC Symposium continues to build upon its heritage as one of the foremost IEEE technical conferences dedicated to the latest innovations in RFIC development of wireless and wire line communication IC’s. On behalf of the RFIC Technical Program Committee, we look forward to seeing you at the 2008 RFIC Symposium in Atlanta. More information may be found at www. rfic2008.org/.
Spring 2008
