IMAPS Workshop on System Level Packaging 2011
LTCC Technology for Wireless System in Package Architecture: Issues & Challenges D. Mathur1, S. K. Bhatnagar2, Vineet Sahula3 Abstract Convergence of computing, communication, consumer and biomedical applications is driving the complexity of emerging multifunctional highly integrated stand-alone wireless communication devices to higher and higher scales. New radio architectures are being introduced with higher data transfer rate. This adds to the complexity of the traditional wireless architecture. The various technologies such as digital, RF, analog, optical, MEMS and sensors are required to accomplish convergence of data, video, voice, sensing, and many other functions. With the objectives of miniaturization, portability, low-cost and performance, the complete integration of these technologies using the traditional 2-D integration on a single chip (System-on-Chip) poses numerous challenges, e.g. low-Q factor, cross-talk, substrate coupling, size restrictions for on-chip integration of passives and antenna. Moreover, distribution of power to the digital and RF circuits in case of multiple voltage levels while maintaining isolation and low EMI is a bigger challenge. This paper addresses the issues and challenges involved in the integration and packaging of these complex micro-system architectures. It is believed that for the next generation wireless systems, heterogeneous integration of system hardware e.g. the system in a package (SiP) or system on a package (SoP) approach is a more feasible option than system on chip (SoC). Recent development of materials and processes in packaging makes it possible to bring the concept of SiP into the RF applications in order to meet the stringent needs in wireless communication area. An SiP is three-dimensional (3D) integration of components as well as their interconnections using multilayer high-density architectures in different technologies with vertical interconnect and embedded component integration. SiP is based on a co-design philosophy to bring together ICs and embedded components at the system level. Investigations on system-in-package have become primary focus due to the real estate efficiency, cost saving and performance improvements potentially involved in this integrated functionality. Multilayer LTCC is a matured and widely used technology and very attractive for its excellent high frequency characteristics, dimensional stability, low TCE, good thermal conductivity, fine line patterning and easy design & fabrication of buried / embedded passives for construction of small size 3D modules. In SiP domain, LTCC can facilitate compact yet efficient wireless system realization by means of passive integration and vertical interconnects. Moreover, low loss nature of the LTCC substrate makes them very suitable for efficient antenna design. This paper brings out the salient features of LTCC technology vis-à-vis system-in-package solution for the emerging wireless architectures. A case study of implementing wireless sensor node architecture using LTCC technology is presented. Key words: LTCC, System-in-Package, 3D integration, Micro-system architecture
IMAPS Workshop on System Level Packaging 2011 1
References: [1] Future Package Technologies for Wireless Communication Systems, Intel Technology Journal, Vol.09, November 2005 [2] M. Blanes et al., A Low Temperature Cofired Ceramic (LTCC) Technology Platform For Heterogeneous Integrated Systems, Proceedings Of 8 th Spanish Conference On Electron Devices, CDE’2011 [3] Shamim A., M. Arsalan and L. Roy, wireless interconnect between on-chip and ltcc antennas for system-in-package applications, Proceedings of the 1st European wireless technology conference, 2008 [4] Douglas J. Mathews and Michael P. Gaynor, Amkor technology, RF System in Package: Considerations, Technologies and Solutions [5] Christian Block & Peter Hagn, Ceramic Based System in Package Solution [6] S. K. Bhatnagar, Parts Synthesis Approach for 3D Integration of MEMS and Microsystems Leading to System-On-Package, International MEMS Conference 2006, Journal of Physics: Conference Series 34 (2006) [7] RaO R. Tummala, SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore’s Law for System Integration of Miniaturized Convergent Systems of the Next Decade, IEEE Transactions On Advanced Packaging, Vol. 27, No. 2, May 2004 [8] Jong-Hoon Lee, et al. Highly Integrated Millimeter-Wave Passive Components Using 3-D LTCC System-on-Package (SOP) Technology, [9] Evan Davidson, SoC or SoP? A Balanced Approach!, 2001 Electronic Components and Technology Conference [10] A. DZIEDZIC, Modern Micropassives: Fabrication And Electrical Properties, Bulletin Of The Polish Academy Of Sciences Technical Sciences Vol. 54, No. 1, 2006 [11] Andrew Mason et al. A Generic Multielement Microsystem for Portable Wireless Applications Proceedings Of The IEEE, Vol. 86, No. 8, August 1998 [12] Steve Scrantom et al. Manufacture of Embedded Integrated Passive Components into Low Temperature Co-Fired Ceramic Systems, [13] Michel Massiot, Evolution of LTCC technology for industrial applications [14] Young Chul Lee and Chul Soon Park, A Novel CPW-to-Stripline Vertical Via Transition Using a Stagger Via Structure and Embedded Air Cavities for V-band LTCC SiP Applications, APMC 2005 Proceedings [15] S. Consolazio et al. Low Temperature Cofired Ceramic (Ltcc) For Wireless Applications, IEEE 1999 [16] Ke-Li Wu and Yong Huang, LTCC Technology and Its Applications in High Frequency Front End Modules, IEEE 2003 [17] L.J. GOLONKA, Technology and applications of Low Temperature Cofired Ceramic (LTCC) based sensors and Microsystems, Bulletin of The Polish Academy of Sciences Technical Sciences Vol. 54, No. 2, 2006
1
Associate Professor, Govt. Engg. College Ajmer INDIA,
[email protected] Emeritus Scientist, CSIR, Jaipur INDIA. 3 Associate Professor, National Institute of Technology Jaipur, INDIA,
[email protected] 2
IMAPS Workshop on System Level Packaging 2011
[18] Liam Devlin, Graham Pearson, Jonathan Pittock, RF and Microwave Component Development in LTCC, [19] J.-H.Lee et al. 3D Integration: A Revolutionary Approach for SOP MillimeterWave Functions for High Data Rate Wireless Systems using Ceramic and Organic Technologies [20] H. Jantunen et al. Design Aspects of Microwave Components With LTCC Technique, Journal of the European Ceramic Society 23, 2003
